Applied Materials, Inc. and the Institute of Microelectronics (IME), a research institute under the Agency for Science, Technology and Research (A*STAR), announced a five-year extension of their research collaboration at the Centre of Excellence in Advanced Packaging in Singapore.   The organizations will expand the scope of their R&D collaboration to focus on advancing Fan-Out Wafer-Level Packaging (FOWLP), a key technology inflection expected to help make chips and end-user devices small...